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09.01.2019 at 21:57 Uhr by Mark Mantel - AMD did not announce any concrete Ryzen 3000 processors with Zen 2 cores at the Ces 2019 Keynote, but gave an interesting view of the next generation. Zen 2 will also use a multi-die approach in the desktop area with a 14 nm I / O chip and at least one 7 nm CPU chiplet. 16-Kerner for the socket AM4 appear quite realistic.

A comprehensive view of his Ryzen 3000 portfolio, as the rumor mill rumored, was not given by AMD at the CES 2019, but the hardware world was given some big appetizers. So far, the chip manufacturer confirmed only in the case of the Epyc processors for the server market, that the multi-die approach is significantly expanded: In addition to a large 14-nm Die of Globalfoundries, the I / O functionality and memory interface provide up to eight Zen-2 chips that benefit from TSMC's 7nm process.

Zen-2-Achtkerner as Engineering Sample measures itself with Intel's Core i9-9900K
In the desktop, AMD will go the same, if broken, approach. CEO Lisa Su showed an AM4 package with two silicon chips: a larger I / O die, also manufactured by Globalfoundries in 14 nm, and the Epyc-known Zen-2 chiplet in 7 nm. Basically, the processor shown is an eight-core with 16 threads. AMD has launched a pre-production copy in Cinebench R15 (multithreaded) against Intel's Core i9-9900K. The latter ran uncovered on an Asus motherboard, so could consume more than 95 watts and therefore extend its all-core turbo. With a system power, ie a total power consumption of the complete systems, from 130 (AMD) to 180 watts (Intel), the two CPUs with a good 2,000 points were at the same level of performance